This product family includes RM, RS, and SEC series, covering lengths from 128 mm to 216 mm, with element counts ranging from 12 to 26. RM series offers bell-type large-diameter interfaces for automated MMD systems; RS series provides adjustable step-style tips for precision low-flow tasks; SEC13-25 is specifically designed for solar photovoltaic junction box potting and frame sealing applications.
For Solar Photovoltaic Applications Btektech’s SEC13-25 dynamic mixing nozzle incorporates motor-driven high-speed rotating spiral elements to deliver precise and uniform blending of low-viscosity two-component materials, widely used and proven reliable in solar photovoltaic junction box potting and frame sealing applications.
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Standard dynamic mixing tubes may not cover every dispensing system or material requirement. Customization allows the nozzle geometry and interface to be adjusted to fit your specific equipment and process conditions.
Produce nozzles to your approved drawing, with specified outer diameter, inner diameter, and inlet interface dimensions.
Develop customized nozzle configurations based on your dispensing system requirements, including blade count and tube length.
Customize solutions including outer and inner diameter sizing, and inlet interface format to match your chemical environment.
Apply branded labeling and configure packaging format to support your own product line or distribution requirements.
Dynamic mixing nozzles enable consistent filler dispersion and bond quality across photovoltaic, aerospace repair, and semiconductor thermal interface applications.
Solar PV manufacturing relies on dynamic mixing for junction box potting and frame sealing, where adhesives are typically loaded with fillers that settle during storage. The rotating blade action keeps filler particles suspended and evenly dispersed throughout the dispensing cycle, supporting consistent bond quality across sola panel production.
Honeycomb panel bonding and composite repair in aerospace applications frequently involve carbon fiber, aluminum powder-loaded repair putties and ceramic-particle high-temperature sealants. Dynamic mixing nozzles can handle these abrasive, dense formulations.
Thermal management adhesives used in chip underfill, die attach, and heat sink bonding, including alumina and boron nitride-filled thermal silicone and silver or nickel powder-loaded conductive adhesives. Dynamic mixing continuously agitates these dense formulations through the dispensing cycle, maintaining uniform filler distribution and delivering consistent deposit quality across high-volume semiconductor packaging and PCB assembly operations.
Our blog is designed to help you deepen your knowledge of fluid dispensing processes, optimize your production line, and select the best components for your specific challenges. Explore articles that connect industry insights with practical solutions.
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